Cleaving Si Wafers

One of the most essential nanoscale skills is cleaving Si wafers. This skill will be practiced in this lab exercise producing substrates that will be used in future patterning labs.

Si (100) wafers
Wafer tweezer
Diamond scribe
Petri dish

Press firmly down on the flat edge (indicates orientation along (110)) of the Si wafer using a diamond scribe while lightly holding a wafer tweezer on the opposite side. The wafer should break nicely in half along a straight line.

Follow the same procedure as above to cut each of the above halves into two pieces.

Cut the Si wafer into eight pieces. Carefully place these pieces in a labeled petri dish for storage. These pieces will be used in future patterning labs.